TE Connectivity 1374463-4 Datový list stáhnout pdf (Strana 62)

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FIBER

Fiber

Fiber Enclosures – Universal Connectivity Platform

Universal Connectivity Platform —

A Modular Approach to Infrastructure Design

TE Connectivity’s Universal Connectivity Platform (UCP) provides a fully modular

approach to designing data centers and telecommunications rooms. This patch

panel is ideal for rapidly evolving environments because it supports both TE’s

plug-and-play copper and ﬁber solutions.

TE’s UCP enables business transformation by virtue of its modularity. It is

designed to accommodate all of TE’s cabling media, whether copper or ﬁber,

to support the 10, 40 and 100 Gigabit network connections in a single patch

panel. By simply selecting the media, network equipment can be changed in a

controlled fashion as the network demands.

Rack space is always a premium in the data center or telecommunications room,

especially in existing infrastructure. The UCP is designed with this in mind,

incorporating maximum ﬂexibility for dierent needs and architecture. The panels

can be installed in a 19 inch cabinet/rack, or installed overhead or under raised

ﬂoors. By moving the panels overhead or under the ﬂoor, they can be easily

shared between cabinets/racks.

Data Centers and co-location sites have undergone radical changes over the

past few years and will again in the future. TE’s Universal Connectivity Platform

helps network managers address this change by delivering added ﬂexibility

andscalability.

FEATURES

• Multimedia Quick-Fit conﬁgurations accommodate both copper and ﬁber

• Compatible with MPOptimate multimode (OM3/

OM4) and singlemode (OS1/OS2) ﬁber media

• Compatible with U/UTP, F/UTP and S/FTP copper media

• Can be installed inside a cabinet/rack, to a wire basket or under a raised ﬂoor

• Scalable to meet all applications from 100 Mbps to

100 Gbps including high-density 10 Gbps deployments

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TE Connectivity 1374463-4 Datový list Strana 62