TE Connectivity 1374463-4 Datový list Strana 57

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FIBER
Fiber
Fiber Enclosures
RMG/AMP NETCONNECT
Modular solution (LGX* footprint)
Single chassis for all applications
Simple design, economical
* LGX is a registered trademark
TFP
Medium Feature – Lower density for better connector access
Modular solution (Unique TE footprint)
Single chassis for all applications
Q3000
High feature with manageable density
Uses blades as user interface
Addresses termination/MPO applications in same chassis
Fiber Enclosure Comparison
Universal Connectivity Platform
• High versatility with excellent value
• Modular solution for both copper and fiber cassettes
• High density (96fibers in 1U)
High Density Equipment Panel
Most advanced cable management – highest manageable density
Interchangeable modules for full 10/40/100 migration
MPOptimate compatible
Managed and unmanaged
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